JPS6120344A - ボンデイング方法 - Google Patents

ボンデイング方法

Info

Publication number
JPS6120344A
JPS6120344A JP59141591A JP14159184A JPS6120344A JP S6120344 A JPS6120344 A JP S6120344A JP 59141591 A JP59141591 A JP 59141591A JP 14159184 A JP14159184 A JP 14159184A JP S6120344 A JPS6120344 A JP S6120344A
Authority
JP
Japan
Prior art keywords
frame
bonding
mark
circuit board
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59141591A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527978B2 (en]
Inventor
Masayoshi Yamaguchi
政義 山口
Masahito Ishikawa
雅仁 石川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
AGC Techno Glass Co Ltd
Original Assignee
Toshiba Corp
Toshiba Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Glass Co Ltd filed Critical Toshiba Corp
Priority to JP59141591A priority Critical patent/JPS6120344A/ja
Publication of JPS6120344A publication Critical patent/JPS6120344A/ja
Publication of JPH0527978B2 publication Critical patent/JPH0527978B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP59141591A 1984-07-09 1984-07-09 ボンデイング方法 Granted JPS6120344A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59141591A JPS6120344A (ja) 1984-07-09 1984-07-09 ボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59141591A JPS6120344A (ja) 1984-07-09 1984-07-09 ボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6120344A true JPS6120344A (ja) 1986-01-29
JPH0527978B2 JPH0527978B2 (en]) 1993-04-22

Family

ID=15295567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59141591A Granted JPS6120344A (ja) 1984-07-09 1984-07-09 ボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6120344A (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103360327B (zh) * 2012-12-13 2016-04-20 中山大学 一种苯并吩嗪衍生物及其制备方法和应用

Also Published As

Publication number Publication date
JPH0527978B2 (en]) 1993-04-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees